Mechanics of transonic debonding of a bimaterial interface: The anti- plane shear case

DOI10.1016/0022-5096(94)90072-8zbMath0836.73058OpenAlexW1977737311MaRDI QIDQ1345995

Wei Yang, Hong-Hui Yu

Publication date: 29 April 1996

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/0022-5096(94)90072-8

zbMATH Keywords

analytical solutionstress singularityenergy fluxCauchy kernelwave speedhyperbolic regionmixed type equationselliptical regionWiener-Hopf type integral equationHilbert projection

Mathematics Subject Classification ID

Fracture and damage (74R99)

Related Items (10)

A general solution method for an anti-plane shear crack dynamically accelerating along a bimaterial interface ⋮ Shear dominated transonic interfacial crack growth in a bimaterial. II: Asymptotic fields and favorable velocity regimes ⋮ Mechanics of transonic debonding of a bimaterial interface: The in-plane case ⋮ Rapid Mode III Interface Flaw Extension: Dissimilar Anisotropic Solids with Largely Arbitrary Orientations of their Principal Material Axes ⋮ Analytical solutions to general anti-plane shear problems in finite elasticity ⋮ Dynamic behaviors of mode III interfacial crack under a constant loading rate ⋮ Analytical solutions of dynamic mode I crack under the conditions of displacement boundary ⋮ Supersonic crack growth in a solid of upturn stress--strain relation under anti-plane shear ⋮ Intersonic crack growth in bimaterial interfaces: an investigation of crack face contact ⋮ Dynamic phenomena and crack propagation in dissimilar elastic lattices

Cites Work

• Highly transient elastodynamic crack growth in a bimaterial interface: Higher order asymptotic analysis and optical experiments
• Mechanics of dynamic debonding
• Dynamic Fracture Mechanics

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