Mechanics of transonic debonding of a bimaterial interface: The in-plane case

DOI10.1016/0022-5096(94)00062-AzbMath0879.73049OpenAlexW2039923672MaRDI QIDQ1354917

Wei Yang, Hong-Hui Yu

Publication date: 22 January 1998

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/0022-5096(94)00062-a

zbMATH Keywords

plane strainplane stressinterfacial crackstress singularitiesRayleigh wave speedangular stress distributionsenergy flow across interfacelongitudinal wave speed

Mathematics Subject Classification ID

Singularities, blow-up, stress concentrations for dynamical problems in solid mechanics (74H35) Stress concentrations, singularities in solid mechanics (74G70) Fracture and damage (74R99)

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Singularity of subsonic and transonic crack propagations along interfaces of magnetoelectroelastic bimaterials ⋮ Analytical solutions of dynamic mode I crack under the conditions of displacement boundary ⋮ Analysis of intersonic crack growth in unidirectional fiber-reinforced composites ⋮ Intersonic crack growth in bimaterial interfaces: an investigation of crack face contact ⋮ Analysis of in-plane transonically propagating interface crack with a finite contact zone ⋮ Dynamic crack growth along a polymer composite--Homalite interface ⋮ A unified method for subsonic and intersonic crack growth along an anisotropic bimaterial interface

Cites Work

• Highly transient elastodynamic crack growth in a bimaterial interface: Higher order asymptotic analysis and optical experiments
• Mechanics of transonic debonding of a bimaterial interface: The anti- plane shear case
• Mechanics of dynamic debonding
• Singularities, interfaces and cracks in dissimilar anisotropic media
• Dynamic Fracture Mechanics