Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging

DOI10.1016/S0307-904X(03)00087-8zbMath1019.80500OpenAlexW2036698865MaRDI QIDQ1401103

Ying-Ling Tsai, Yu-Fang Chiu, Weng-Sing Hwang

Publication date: 17 August 2003

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0307-904x(03)00087-8

zbMATH Keywords

Solidification Electronic packaging Lead-tin alloy Reflow process Solder joint

Mathematics Subject Classification ID

Finite difference methods applied to problems in thermodynamics and heat transfer (80M20)

Cites Work

Effects of the rate of latent heat release on fluid flow and solidification patterns during alloy solidification

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