Adhesive elements for stress analysis of bonded patch to curved thin-walled structures

DOI10.1007/S00466-002-0374-3zbMATH Open1018.74531OpenAlexW2057858695MaRDI QIDQ1404601

D. Massart

Publication date: 21 August 2003

Published in: Computational Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00466-002-0374-3

zbMATH Keywords

Finite element analysisStress analysisCurvatureBonded patchThin-walled structures

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Composite and mixture properties (74E30)

Related Items (1)

Glass-modified stress waves for adhesion measurement of ultra thin films for device applications.

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