Diffusive shrinkage of a void within a grain of a stressed polycrystal.
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Publication:1415907
DOI10.1016/S0022-5096(02)00039-XzbMath1044.74009OpenAlexW2066277465MaRDI QIDQ1415907
Publication date: 9 December 2003
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(02)00039-x
Related Items (2)
The stress intensity factor of an edge dislocation near an elliptically blunted crack tip ⋮ Effects of electric and mechanical loads on the morphological evolution of a void in piezoelectric films
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