The effects of thermal softening and heat conduction on the dynamic growth of voids.
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Publication:1427162
DOI10.1016/S0020-7683(03)00214-2zbMath1041.74538MaRDI QIDQ1427162
Publication date: 14 March 2004
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
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Related Items (5)
Continuum framework for the rate-dependent behavior of anisotropically damaged ductile metals ⋮ A physical model for nucleation and early growth of voids in ductile materials under dynamic loading ⋮ A micromechanical constitutive model for dynamic damage and fracture of ductile materials ⋮ Dynamic void nucleation and growth in solids: A self-consistent statistical theory ⋮ A convected-particle tetrahedron interpolation technique in the material-point method for the mesoscale modeling of ceramics
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