Mode III stress intensity factors for edge-cracked circular shafts, bonded wedges, bonded half-planes and DCB's.

DOI10.1016/S0020-7683(03)00435-9zbMath1057.74011OpenAlexW2042873300MaRDI QIDQ1430811

Amir Reza Shahani

Publication date: 27 May 2004

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(03)00435-9

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

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The mode III stress/electric intensity factors and singularities analysis for edge-cracked circular piezoelectric shafts ⋮ Anti-plane stress analysis of dissimilar sectors with multiple defects ⋮ Interfacial wedge cracks in dissimilar anisotropic materials under antiplane shear ⋮ Numerical methods for solving singular integral equations obtained by fracture mechanical analysis of cracked wedge ⋮ On the antiplane shear deformation of finite wedges ⋮ Stress analysis of two kinds of dissimilar isotropic sectors ⋮ Mode III fracture analysis of an anisotropic finite wedge with an interfacial crack ⋮ A wedge crack in an anisotropic material under antiplane shear ⋮ Jordan-form special solutions corresponding to arbitrary anti-plane shear forces in polynomial forms imposed on bimaterial interfacial crack surfaces ⋮ A solution for an isotropic sector under anti-plane shear loadings ⋮ Analysis of anisotropic sector with a radial crack under anti-plane shear loading ⋮ Analysis of bonded anisotropic wedges with interface crack under anti-plane shear loading

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