A coupled electromechanical analysis of a piezoelectric layer bonded to an elastic substrate. I: Development of governing equations.
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Publication:1430827
DOI10.1016/S0020-7683(03)00307-XzbMath1074.74027OpenAlexW2007838945MaRDI QIDQ1430827
Jinghong Fan, Benniu Zhang, Jun-Qian Zhang
Publication date: 27 May 2004
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0020-7683(03)00307-x
singular integral equationsseries solutiondifferential equationsHellinger-Reissner variational principle
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The effect of bonding layer properties on the dynamic behaviour of surface-bonded piezoelectric sensors ⋮ The dynamic behaviour of surface-bonded piezoelectric actuators with debonded adhesive layers ⋮ A fast BEM for the analysis of damaged structures with bonded piezoelectric sensors ⋮ On the dynamic behavior of piezoelectric sensors and actuators embedded in elastic media ⋮ Wave propagation generated by piezoelectric actuators attached to elastic substrates
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