A thermodynamic model for electrical current induced damage

DOI10.1016/J.IJSOLSTR.2003.08.018zbMath1063.74534OpenAlexW2046340437WikidataQ56338346 ScholiaQ56338346MaRDI QIDQ1434684

Cemal Basaran, Minghui Lin, Hua Ye

Publication date: 12 July 2004

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2003.08.018

zbMATH Keywords

diffusionvoid growthnanomechanicselectromigrationsolder joints

Mathematics Subject Classification ID

Thermodynamics in solid mechanics (74A15) Fracture and damage (74R99) Electromagnetic effects in solid mechanics (74F15)

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A theory of damage and self-regenerating materials ⋮ Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework ⋮ Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress ⋮ A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy ⋮ Introducing damage mechanics templates for the systematic and consistent formulation of holistic material damage models

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