Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
From MaRDI portal
Publication:1566558
DOI10.1016/S0017-9310(99)00151-9zbMath0969.80009WikidataQ126771446 ScholiaQ126771446MaRDI QIDQ1566558
Andrei G. Fedorov, Raymond Viskanta
Publication date: 26 November 2000
Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)
electronic packagingflowconjugate heat transferfriction coefficientthermal resistanceReynolds numbersaverage heat transfer characteristicsconvection-conductionincompressible laminar Navier-Stokes equationsmicrochannel-based heat sinktemperature and heat flux distributions
Related Items (26)
Interaction effects on heat conduction and thermal stress in an infinite elastic plane with two circular holes ⋮ The interaction of iteration error and stability for linear partial differential equations coupled through an interface ⋮ Thermal and hydraulic characteristics of nanofluid in a triangular grooved microchannel heat sink (TGMCHS) ⋮ Modeling and simulation on the mass flow distribution in microchannel heat sinks with non-uniform heat flux conditions ⋮ Numerical computation of 3D heat transfer in complex parallel heat exchangers using generalized graetz modes ⋮ Thermal optimization of square pin-fins in crossflow using the lattice Boltzmann method with quadratic thermal equilibrium ⋮ Internal convective heat transfer of nanofluids in different flow regimes: a comprehensive review ⋮ A multi region adjoint-based solver for topology optimization in conjugate heat transfer problems ⋮ Analytical properties of Graetz modes in parallel and concentric configurations ⋮ FEM for the 3-D analysis of conjugate conduction-convection heat transfer in cross-flow micro heat exchangers ⋮ Numerical investigation on the performance of cross-flow micro heat exchangers ⋮ Single-phase and two-phase cooling using hybrid micro-channel/slot-jet module ⋮ Single-phase and two-phase heat transfer characteristics of low temperature hybrid micro-channel/micro-jet impingement cooling module ⋮ Single-phase hybrid micro-channel/micro-jet impingement cooling ⋮ Three-dimensional laminar flow and heat transfer in a parallel array of microchannels etched on a substrate ⋮ Effects of jet pattern on single-phase cooling performance of hybrid micro-channel/micro-circular-jet-impingement thermal management scheme ⋮ Simulation of steady fluid-solid conjugate heat transfer problems via immersed boundary-lattice Boltzmann method ⋮ Finite element based heatline approach to study mixed convection in a porous square cavity with various wall thermal boundary conditions ⋮ Multi-parameters optimization for microchannel heat sink using inverse problem method ⋮ Cooling augmentation using microchannels with rotatable separating plates ⋮ Analysis of mixed convection in a lid-driven porous square cavity with linearly heated side wall(s) ⋮ Use of the method of manufactured solutions for the verification of conjugate heat transfer solvers ⋮ Conjugate heat transfer in an enclosure under the condition of internal mass transfer and in the presence of the local heat source ⋮ An experimental and numerical study of forced convection in a microchannel with negligible axial heat conduction ⋮ Conjugate problems in convective heat transfer: review ⋮ Analysis and optimization of the thermal performance of microchannel heat sinks
This page was built for publication: Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
