Adhesively bonded assemblies with identical nondeformable adeherends and `piecewise continuous' adhesive layer: Predicted thermal stresses in the adhesive

DOI10.1016/S0020-7683(98)00317-5zbMath1049.74537OpenAlexW2042443384MaRDI QIDQ1573017

E. Suhir

Publication date: 2000

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(98)00317-5

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Junctions (74K30)

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