Rigid stamp indentation for a thermoelastic half-plane

DOI10.1016/S0020-7683(99)00138-9zbMath0968.74049OpenAlexW2078321903MaRDI QIDQ1573399

Ching-Kong Chao, Bin Gao

Publication date: 24 September 2001

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(99)00138-9

zbMATH Keywords

rigid punchcontact stressmethod of analytical continuationthermoelastic half-plane

Mathematics Subject Classification ID

Contact in solid mechanics (74M15) Thermal effects in solid mechanics (74F05)

Related Items (2)

Adhesive behavior between dissimilar materials subjected to thermo-elastic loadings with normal-tangential coupling effect ⋮ Static equilibrium of a thermoelastic half-plane: Green's functions and solutions in integrals

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