Atomistic simulations on the tensile debonding of an aluminum-silicon interface.

DOI10.1016/S0022-5096(99)00086-1zbMath1052.74502OpenAlexW2003901771WikidataQ127352965 ScholiaQ127352965MaRDI QIDQ1582441

Ken Gall, M. I. Baskes, Mark Van Schilfgaarde, Mark F. Horstemeyer

Publication date: 2000

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0022-5096(99)00086-1

Mathematics Subject Classification ID

Structured surfaces and interfaces, coexistent phases (74A50) Micromechanical theories (74A60) Theories of fracture and damage (74A45)

Related Items (4)

Molecular-dynamics simulation-based cohesive zone representation of intergranular fracture processes in aluminum ⋮ Dynamic phenomena and crack propagation in dissimilar elastic lattices ⋮ Atomistic simulations of Bauschinger effects of metals with high angle and low angle grain boundaries ⋮ Statistical volume element method for predicting microstructure-constitutive property relations

Cites Work

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• Stability of solids with interfaces
• The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
• Analytical derivation and investigation of the interface crack models
• Effect on interfacial compliance on bifurcation of a layer bonded to a substrate
• Crack deflection at an interface between dissimilar elastic materials: Role of residual stresses
• Numerical modeling of crack growth under dynamic loading conditions
• Computational modelling of impact damage in brittle materials
• A Continuum Model for Void Nucleation by Inclusion Debonding
• The elastic field outside an ellipsoidal inclusion

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