Mode-dependent toughness and the delamination of compressed thin films
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Publication:1584900
DOI10.1016/S0022-5096(00)00007-7zbMath0992.74051OpenAlexW1993139532WikidataQ59923846 ScholiaQ59923846MaRDI QIDQ1584900
Publication date: 6 November 2000
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(00)00007-7
bifurcationsbuckle-driven delaminationcompressed thin filmsblisterfilm/substrate interfacemode dependence
Related Items (4)
ON A NONLOCAL FUNCTIONAL ARISING IN THE STUDY OF THIN-FILM BLISTERING ⋮ Nonlinear analyses of wrinkles in a film bonded to a compliant substrate ⋮ Asymptotic study of the interfacial crack with friction ⋮ Self-similar folding patterns and energy scaling in compressed elastic sheets
Cites Work
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- Effect of friction on the interface crack loaded in shear
- One dimensional modelling of failure in laminated plates by delamination buckling
- An asymptotic analysis of stationary and moving cracks with frictional contact along bimaterial interfaces and homogeneous solids
- Asymptotic study of the interfacial crack with friction
- The effect of interfacial friction on the buckle-driven spontaneous delamination of a compressed thin film
- Mixed Mode Cracking in Layered Materials
- Crumpled paper
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