Application of bimaterial interface corner failure mechanics to silicon/glass anodic bonds
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Publication:1601676
DOI10.1016/S0022-5096(01)00087-4zbMath1114.74478OpenAlexW2049259399MaRDI QIDQ1601676
Paul E. W. Labossiere, Shawn J. Cunningham, Martin L. Dunn
Publication date: 27 June 2002
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(01)00087-4
Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70) Composite and mixture properties (74E30)
Related Items (6)
Convenient Adhesive Strength Evaluation Method in Terms of the Intensity of Singular Stress Field ⋮ Evaluation of fracture mechanics parameters for free edges in multi-layered structures with weak singularities ⋮ General size effect on strength of bimaterial quasibrittle structures ⋮ A failure criterion for brittle elastic materials under mixed-mode loading ⋮ Singular stress field near interface edge in orthotropic/isotropic bi-materials ⋮ Initiation of fracture at the interface corner of bi-material joints.
Cites Work
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- Finite element analysis of anisotropic materials with singular inplane stress fields
- Explicit solution and invariance of the singularities at an interface crack in anisotropic composites
- On the stress singularities in the plane elasticity of the composite wedge
- Edge singularities in anisotropic composites
- On the singular behavior at the vertex of a bi-material wedge
- Interfacial crack-tip field in anisotropic elastic solids
- Interfacial cracking from the free-edge of a long bi-material strip
- Stress singularities in a bimaterial joint with inhomogeneous temperature distribution
- Cohesive zone modeling of crack nucleation at bimaterial corners
- Connection between interface corner and interfacial fracture analyses of an adhesively-bonded butt joint
- An application of two-state \(M\)-integral for computing the intensity of the singular near-tip field for a generic wedge
- Stress singularities at interface corners in bonded dissimilar isotropic elastic materials
- Dislocations and Cracks in Anisotropic Elasticity
- Mixed Mode Cracking in Layered Materials
- Plane Solutions for the Displacement and Traction-Displacement Problems for Anisotropic Elastic Wedges
- Near-Tip Fields in a Notched Body With Dislocations and Body Forces
- Crack Initiation From Homogeneous and Bimaterial Corners
- Numerical analysis of singularities in two‐dimensions part 1: Computation of eigenpairs
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