A meshless collocation method for the coupled analysis of functionally graded piezo-thermo-elastic shells and plates under thermal loads
DOI10.1016/j.ijengsci.2012.03.001zbMath1423.74643OpenAlexW2022303853MaRDI QIDQ1659864
Chih-Ping Wu, Ruei-Yong Jiang, Kuan-Hao Chiu
Publication date: 23 August 2018
Published in: International Journal of Engineering Science (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijengsci.2012.03.001
shellscollocation methodsmeshless methodsFG materialcoupled piezo-thermo-elastic effectsDRK interpolation
Control, switches and devices (``smart materials) in solid mechanics (74M05) Plates (74K20) Thermal effects in solid mechanics (74F05) Shells (74K25) Electromagnetic effects in solid mechanics (74F15) Spectral and related methods applied to problems in solid mechanics (74S25)
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