An opening crack model for thermopiezoelectric solids
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Publication:1668359
DOI10.1016/J.EUROMECHSOL.2013.03.004zbMath1406.74507OpenAlexW2045010170WikidataQ105461034 ScholiaQ105461034MaRDI QIDQ1668359
Publication date: 3 September 2018
Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.euromechsol.2013.03.004
Control, switches and devices (``smart materials) in solid mechanics (74M05) Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)
Related Items (4)
Two collinear cracks under combined quadratic thermo-electro-elastic loading ⋮ Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor ⋮ Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors ⋮ A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface
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