A theoretical analysis of the electromigration-induced void morphological evolution under high current density

DOI10.1007/S10409-017-0645-ZzbMath1380.74036OpenAlexW2589793971MaRDI QIDQ1695572

Yao Yao, Yuexing Wang

Publication date: 7 February 2018

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-017-0645-z

zbMATH Keywords

analytical solutionmass diffusionelectromigrationhigh current densityvoid evolution

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15)

Cites Work

• Unnamed Item
• Analytical solution for motion of an elliptical inclusion in gradient stress field
• Heat conduction and thermal stress induced by an electric current in an infinite thin plate containing an elliptical hole with an edge crack
• Creep flow, diffusion, and electromigration in small scale interconnects
• A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
• Electromigration of intergranular voids in metal films for microelectronic interconnects.
• Void growth in power-law creeping solids: effect of surface diffusion and surface energy

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