Mechanics of Smart-Cut technology

DOI10.1016/J.IJSOLSTR.2004.02.054zbMath1062.74579OpenAlexW2045174233MaRDI QIDQ1781473

Yonggang Y. Huang, Xi Qiao Feng

Publication date: 27 June 2005

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2004.02.054

zbMATH Keywords

FractureStress intensity factorMicro-mechanicsSemiconductor materialCrackAnalytic solutionDebondingChemo-mechanical process

Mathematics Subject Classification ID

Stress concentrations, singularities in solid mechanics (74G70) Micromechanics of solids (74M25) Chemical structure in solid mechanics (74E40)

Related Items (2)

Fracture mechanics analysis on smart-cut\(^\circledR\) technology. II: Effect of bonding flaws ⋮ Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction

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