Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors

DOI10.1016/j.euromechsol.2018.01.010zbMath1406.74620OpenAlexW2790257028MaRDI QIDQ1788375

ChangHai Yang, Ming-Hao Zhao, Cui Ying Fan, Guang Tao Xu

Publication date: 8 October 2018

Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.euromechsol.2018.01.010

zbMATH Keywords

fundamental solutionspenny-shaped crackintensity factorextended displacement discontinuity boundary element methodthermal piezoelectric semiconductor

Mathematics Subject Classification ID

Brittle fracture (74R10) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)

Related Items (6)

A shooting method for nonlinear boundary value problems in a thermal piezoelectric semiconductor plate ⋮ Thermoelastic analysis of a cracked orthotropic strip under heat conduction effect of crack interior ⋮ Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor ⋮ An efficient iteration approach for nonlinear boundary value problems in 2D piezoelectric semiconductors ⋮ Calculation of Stress Intensity Factors for an Arbitrary Oriented Penny-shaped Crack Under Inner Pressure in an Orthotropic Electroelastic Material ⋮ SH waves in multilayered piezoelectric semiconductor plates with imperfect interfaces

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