Thermoelectroelastic analysis of cracks in piezoelectric half-plane by BEM

DOI10.1007/s004660050415zbMath0951.74077OpenAlexW2062734397MaRDI QIDQ1807058

Qing-Hua Qin

Publication date: 18 December 2000

Published in: Computational Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s004660050415

zbMATH Keywords

perturbationGreen's functionboundary element methodStroh formalismpoint heat sourcemultiple crack problemtemperature discontinuitypiezoelectric half-planepotential variational principletwo-crack system

Mathematics Subject Classification ID

Brittle fracture (74R10) Boundary element methods applied to problems in solid mechanics (74S15) Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)

Related Items (8)

Hybrid fundamental solution based finite element method: theory and applications ⋮ Boundary integral equations for 2D thermoelectroelasticity of a half-space with cracks and thin inclusions ⋮ On the conventional boundary integral equation formulation for piezoelectric solids with defects or of thin shapes. ⋮ Green's functions and boundary element method for transversely isotropic piezoelectric materials ⋮ Micromechanics-BE solution for properties of piezoelectric materials with defects ⋮ Green's functions for two-phase transversely isotropic magneto-electro-elastic media ⋮ Boundary element modeling of cracks in piezoelectric solids. ⋮ Analysis of thin piezoelectric solids by the boundary element method

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