A new thermoelectroelastic solution for piezoelectric materials with various openings

DOI10.1007/BF01179544zbMath0951.74019MaRDI QIDQ1818657

Qing-Hua Qin, Yiu-Wing Mai

Publication date: 4 January 2001

Published in: Acta Mechanica (Search for Journal in Brave)

zbMATH Keywords

conformal mappingstrain energy release ratecomplex potentialelectric displacementhoop stresscrack problemsLekhnitskii's formulationinfinite piezoelectric plateinsulated holestress-electric displacement intensity factorthermoelectroelastic analysis

Mathematics Subject Classification ID

Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)

Cites Work

• Unnamed Item
• Plane problems in piezoelectric media with defects
• Piezoelectric solid with an elliptic inclusion or hole
• New developments concerning piezoelectric materials with defects
• Anisotropic Plates With Various Openings Under Uniform Loading or Pure Bending
• Crack Extension Force in a Piezoelectric Material
• Thermal Stresses Due to Disturbance of Uniform Heat Flow by an Insulated Ovaloid Hole
• Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium

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