Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
From MaRDI portal
Publication:1937621
DOI10.1007/S11012-008-9188-5zbMath1258.74187OpenAlexW1989444813MaRDI QIDQ1937621
Publication date: 1 March 2013
Published in: Meccanica (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s11012-008-9188-5
singular integral equationsfunctionally graded piezoelectric materialarbitrarily oriented crackGauss-Chebyshev integration formula
Related Items (7)
Interface edge crack in a multiferroic semicylinder ⋮ Mode III fracture of an arbitrary oriented crack in two dimensional functionally graded material ⋮ A piezoelectric screw dislocation interacting with a half-plane trimaterial composite ⋮ Arc-shaped interfacial crack in a non-homogeneous electro-elastic hollow cylinder with orthotropic dielectric layer ⋮ Interface crack between isotropic Kirchhoff plates ⋮ The cyclically symmetric anti-plane fracture analysis for the arc-shaped interface in a non-homogeneous bimaterial cylindrical structure ⋮ Non-local theory solution to a 3-D rectangular crack in an infinite transversely isotropic elastic material
Cites Work
- The general problem for an arbitrarily oriented crack in a FGM layer
- Bonded half planes containing an arbitrarily oriented crack
- A mode III crack in functionally graded piezoelectric materials
- Mode III crack problems for two bonded functionally graded piezoelectric materials
- The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane
- Mode III eccentric crack in a functionally graded piezoelectric strip
- Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
- Antiplane Crack Problem in Functionally Graded Piezoelectric Materials
This page was built for publication: Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
