Effect of heat-conductive filler of interface gap on thermoelastic contact of solids

DOI10.1016/J.IJHEATMASSTRANSFER.2011.09.053zbMath1262.80040OpenAlexW1969826793MaRDI QIDQ1948947

Yanyan Li

Publication date: 25 April 2013

Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2011.09.053

zbMATH Keywords

gapthermoelastic contactgroovecontact thermal resistanceheat-conductive fillerthermal distortivity

Mathematics Subject Classification ID

Nonlinear elasticity (74B20) Thermal effects in solid mechanics (74F05)

Related Items (2)

Thermal stressed state of a bimaterial with interface crack filled with a compressible liquid ⋮ The thermoelastic contact problem for wavy surfaces with a heat-conducting medium in interface gaps

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