Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods

DOI10.1007/S00419-008-0292-8zbMath1264.74154OpenAlexW2065785655MaRDI QIDQ1952390

H. Worrack, Wolfgang H. Müller, T. Hannach, T. Hauck

Publication date: 30 May 2013

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-008-0292-8

zbMATH Keywords

Coffin-Manson relationcreep soldermicroelectronics reliability

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Junctions (74K30)

This page was built for publication: Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods