Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending
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Publication:1953270
DOI10.1016/J.IJMECSCI.2008.12.003zbMATH Open1264.74155OpenAlexW2007699301MaRDI QIDQ1953270
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Publication date: 7 June 2013
Published in: (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijmecsci.2008.12.003
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