A 2-D model that accounts for 3-D fringing in MEMS devices

DOI10.1016/j.enganabound.2006.07.007zbMath1195.78082OpenAlexW2068959278MaRDI QIDQ1958248

Krishnan Suresh, Murari Sinha

Publication date: 28 September 2010

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.enganabound.2006.07.007

zbMATH Keywords

dimensional reductionCADMEMSfringing

Mathematics Subject Classification ID

Electro- and magnetostatics (78A30)

Cites Work

• The derivation of a thick and thin plate formulation without ad hoc assumptions
• Numerical analysis of 3D electrostatics of deformable conductors using a Lagrangian approach
• MST MEMS model order reduction: requirements and benchmarks
• Electrostatic BEM for MEMS with thin conducting plates and shells
• A fast boundary cloud method for 3D exterior electrostatic analysis
• The hierarchical concept in finite element analysis
• Optimal shape design of three-dimensional MEMS with applications to electrostatic comb drives
• A fast algorithm for three‐dimensional electrostatics analysis: fast Fourier transform on multipoles (FFTM)

This page was built for publication: A 2-D model that accounts for 3-D fringing in MEMS devices