BEM calculation of the complex thermal impedance of microelectronic devices

DOI10.1016/j.enganabound.2006.09.010zbMath1195.80032OpenAlexW2046540271MaRDI QIDQ1958304

Gilbert De Mey, Bjorn Vermeersch

Publication date: 28 September 2010

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://biblio.ugent.be/publication/361351

zbMATH Keywords

Green's functionboundary element methodheat transfermicroelectronicsNyquist plotphasor notationthermal impedance

Mathematics Subject Classification ID

Boundary element methods applied to problems in thermodynamics and heat transfer (80M15)

Related Items

The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure ⋮ A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging ⋮ BEM calculation of the complex thermal impedance of microelectronic devices

Cites Work

• A formulation of the boundary element method for axisymmetric transient heat conduction
• 2D and 3D transient heat conduction analysis by BEM via particular integrals
• Transient heat conduction in homogeneous and non-homogeneous materials by the Laplace transform Galerkin boundary element method
• Dual reciprocity BEM without matrix inversion for transient heat conduction
• BEM calculation of the complex thermal impedance of microelectronic devices
• Three-dimensional singular boundary elements for corner and edge singularities in potential problems
• Unnamed Item

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