Singular thermal residual stress field near the interface corner of bonded dissimilar materials

DOI10.1007/s10704-005-3179-5zbMath1196.74065OpenAlexW2023398006MaRDI QIDQ1959905

Nan Ling Peng, Juan Yang, Min Zhong Wang

Publication date: 12 October 2010

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-005-3179-5

zbMATH Keywords

stress singularitythermal stressesplane elasticityinterface cornerwedge paradox

Mathematics Subject Classification ID

Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05)

Cites Work

• On the stress singularities in the plane elasticity of the composite wedge
• On the singular behavior at the vertex of a bi-material wedge
• Stress singularities in a bimaterial joint with inhomogeneous temperature distribution
• The analysis of thermal residual stresses near the apex in bonded dissimilar materials
• The order of singularity at a multi-wedge corner of a composite plate
• On the problem of edge-bonded elastic quarter-planes loaded at the boundary
• Stress singularities at interface corners in bonded dissimilar isotropic elastic materials
• Stress Behavior at the Interface Junction of an Elastic Inclusion
• Singular Stress Field Near the Corner of Jointed Dissimilar Materials

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