Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
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Publication:1968692
DOI10.1016/S0022-5096(98)00079-9zbMath0964.74073OpenAlexW2010765420MaRDI QIDQ1968692
Publication date: 16 July 2001
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(98)00079-9
surface diffusionthree-dimensional finite element methodelectromigrationidealized interconnect linestrain induced rougheningthin epitaxial film
Structured surfaces and interfaces, coexistent phases (74A50) Finite element methods applied to problems in solid mechanics (74S05) Technical applications of optics and electromagnetic theory (78A55)
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Cites Work
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- A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
- Modified shape functions for the three-node plate bending element passing the patch test
- Evolution of roughness on the surface of a strained elastic material due to stress-driven surface diffusion
