Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
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Publication:1980144
DOI10.1016/J.ENGANABOUND.2021.06.013OpenAlexW3186829813MaRDI QIDQ1980144
ChangHai Yang, Chunsheng Lu, Qiaoyun Zhang, Ming-Hao Zhao
Publication date: 3 September 2021
Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.enganabound.2021.06.013
penny-shaped crackpiezoelectric semiconductorextended stress intensity factorssemi-permeable boundary condition
Cites Work
- Analysis of cracked piezoelectric solids by a mixed three-dimensional BE approach
- General solution for transversely isotropic magneto-electro-thermo-elasticity and the potential theory method
- An anti-plane crack in a piezoelectric semiconductor
- General solutions for coupled equations for piezoelectric media
- Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method
- Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor
- Numerical simulation of crack growth in piezoelectric structures by BEM
- An opening crack model for thermopiezoelectric solids
- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
- Modeling of cracks in 3D piezoelectric finite media by weakly singular SGBEM
- Analysis of fractures in 3D piezoelectric media by a weakly singular integral equation method
- 3D point force solution for a permeable penny-shaped crack embedded in an infinite transversely isotropic piezoelectric medium
- Three-dimensional BEM for piezoelectric fracture analysis
- Finite-part integral and boundary element method to solve three-dimensional crack problems in piezoelectric materials
- A mode III crack in a piezoelectric semiconductor of crystals with 6 mm symmetry
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