Stress intensity factor for multiple cracks in bonded dissimilar materials using hypersingular integral equations

DOI10.1016/j.apm.2019.04.002zbMath1481.74659OpenAlexW2936741128WikidataQ128086555 ScholiaQ128086555MaRDI QIDQ1984926

Norazak Senu, K. B. Hamzah, Zainidin K. Eshkuvatov, Nik Mohd Asri Nik Long

Publication date: 7 April 2020

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.apm.2019.04.002

zbMATH Keywords

stress intensity factorshypersingular integral equationmultiple cracksdissimilar materials

Mathematics Subject Classification ID

Brittle fracture (74R10)

Related Items (5)

Stress intensity factors for bonded two half planes weakened by thermally insulated cracks ⋮ An advanced boundary integral equation method for wave propagation analysis in a layered piezoelectric phononic crystal with a crack or an electrode ⋮ Effect of Mechanical Loadings on Two Unequal Slanted Cracks Length in Bi-Materials Plate ⋮ Stress intensity factor for bonded dissimilar materials weakened by multiple cracks ⋮ Elastic stress analysis of blunt V-notches under mixed mode loading by considering higher order terms

Cites Work

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• Hypersingular integral equation for multiple curved cracks problem in plane elasticity
• Complex variable approach to the BEM for multiple crack problems
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• Propagation of a Dugdale crack at the edge of a half plane
• Stress intensity factors for four interface-close cracks between a nonhomogeneous bonding layer and one of two dissimilar elastic half-planes
• Mode stresses for the interaction between an inclined crack and a curved crack in plane elasticity
• Stress intensity factor for an elastic half plane weakened by multiple curved cracks
• Stress intensity factor for an infinite plane containing three collinear cracks under compression
• A crack near the interface of bonded elastic-viscoelastic planes

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