Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging
DOI10.1016/J.CAMWA.2019.10.009zbMath1443.80021arXiv1809.09034OpenAlexW2985946412MaRDI QIDQ2004642
Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ulrich Römer
Publication date: 7 October 2020
Published in: Computers \& Mathematics with Applications (Search for Journal in Brave)
Full work available at URL: https://arxiv.org/abs/1809.09034
Technical applications of optics and electromagnetic theory (78A55) Numerical methods for partial differential equations, initial value and time-dependent initial-boundary value problems (65M99) Radiative heat transfer (80A21)
Uses Software
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