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Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging - MaRDI portal

Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging

From MaRDI portal
Publication:2004642

DOI10.1016/J.CAMWA.2019.10.009zbMath1443.80021arXiv1809.09034OpenAlexW2985946412MaRDI QIDQ2004642

Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ulrich Römer

Publication date: 7 October 2020

Published in: Computers \& Mathematics with Applications (Search for Journal in Brave)

Full work available at URL: https://arxiv.org/abs/1809.09034





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