Thermal analysis of electronic packaging structure using isogeometric boundary element method
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Publication:2040778
DOI10.1016/j.enganabound.2021.04.008OpenAlexW3154625691MaRDI QIDQ2040778
Huiping Yu, Fei Qin, Yanpeng Gong, Yubo Guo
Publication date: 14 July 2021
Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.enganabound.2021.04.008
radial integration methodnearly singular integralsIGABEMelectronic packaging structuremulti-scale property of geometry
Related Items (2)
The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure ⋮ An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources
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Cites Work
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