Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations

DOI10.1016/j.apm.2020.09.054zbMath1481.74660OpenAlexW3092458453WikidataQ112880202 ScholiaQ112880202MaRDI QIDQ2056570

Norazak Senu, K. B. Hamzah, Zainidin K. Eshkuvatov, Nik Mohd Asri Nik Long

Publication date: 8 December 2021

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.apm.2020.09.054

zbMATH Keywords

stress intensity factorhypersingular integral equationbonded dissimilar materialsthermally insulated cracks

Mathematics Subject Classification ID

Systems of singular linear integral equations (45F15) Brittle fracture (74R10) Thermal effects in solid mechanics (74F05)

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Cites Work

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• Hypersingular integral equation for multiple curved cracks problem in plane elasticity
• A thermoelastic problem for a crack between dissimilar anisotropic media
• Numerical evaluation of hypersingular integrals
• Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
• An internal crack parallel to the boundary of a nonhomogeneous half plane under thermal loading
• Thermoelastic Fracture Mechanics for Nonhomogeneous Material Subjected to Unsteady Thermal Load
• Derivation of a new analytical solution for a general two‐dimensional finite‐part integral applicable in fracture mechanics
• Numerical solution of three-dimensional crack problem by using hypersingular integral equation

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