The effectiveness of the bonding layer to attain reliable thermoelectric structures
From MaRDI portal
Publication:2077508
DOI10.1016/j.euromechsol.2022.104513OpenAlexW4205940351MaRDI QIDQ2077508
Publication date: 21 February 2022
Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.euromechsol.2022.104513
integro-differential equationthermoelectric materialselectrodeinterface contact analysisthermal and electric loadings
Related Items (3)
Interfacial behavior of a thermoelectric film bonded to a graded substrate ⋮ Continuous contact problem of interaction between two arbitrarily positioned flat stamps on the thermoelectric material ⋮ The applicable range of the Goodman approximation in non-slipping contact of elastic materials with thermoelectric effects
Cites Work
- Unnamed Item
- Surface contact behavior of functionally graded thermoelectric materials indented by a conducting punch
- Closed-loop based detection of debonding of piezoelectric actuator patches in controlled beams
- Thermoelectric fields and associated thermal stresses for an inclined elliptic hole in thermoelectric materials
- A continuum theory of thermoelectric bodies and effective properties of thermoelectric composites
- An exact and explicit treatment of an elliptic hole problem in thermopiezoelectric media
- A general model for studying effects of interface layers on thermoelectric devices performance
- Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids
- Bidirectional evolutionary optimization design of material stiffness for the uniformity of the contact stress
- Thickness size effect on contact behavior of a thermoelectric strip
- On coupling contact analysis of thermoelectric materials
- Partition of unity finite element for analysis of contact interface stress singularity
- Non associative damage interface model for mixed mode delamination and frictional contact
- On the numerical solution of singular integral equations
- Thermoelectroelastic solution for elliptic inclusions and application to crack-inclusion problems
This page was built for publication: The effectiveness of the bonding layer to attain reliable thermoelectric structures