Interfacial behavior of thin film bonded to plastically graded substrate under tensile loading
DOI10.1016/j.euromechsol.2022.104818zbMath1504.74057OpenAlexW4304080743MaRDI QIDQ2102604
Peijian Chen, Yufei Wu, Wang Guo, Hao Liu, Guangjian Peng, Jia-Ming Zhu
Publication date: 29 November 2022
Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.euromechsol.2022.104818
finite element methodinterfacial damagevon Mises yield criteriondimension analysisinterfacial stressisotropical power-law hardeningplastic deformation energy
Small-strain, rate-independent theories of plasticity (including rigid-plastic and elasto-plastic materials) (74C05) Anelastic fracture and damage (74R20) Finite element methods applied to problems in solid mechanics (74S05) Thin films (74K35)
Cites Work
- Determination of constitutive response of plastically graded materials
- Mechanics of adhesive contact on a power-law graded elastic half-space
- Constraint effects in adhesive joint fracture
- Beam theory models for thin film segments cohesively bonded to an elastic half space
- Indentation of plastically graded substrates by sharp indentors
- Notch tip fields in amorphous films resting on ductile substrates
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