An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

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Publication:2109682

DOI10.1016/j.apm.2022.03.047zbMath1505.80004OpenAlexW4226497820WikidataQ113880201 ScholiaQ113880201MaRDI QIDQ2109682

Chunying Dong, Fei Qin, Yanpeng Gong, Jon Trevelyan

Publication date: 21 December 2022

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.apm.2022.03.047




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