Frictional moving contact problem between a conducting rigid cylindrical punch and a functionally graded piezoelectric layered half plane

DOI10.1007/s11012-021-01407-2zbMath1483.74071OpenAlexW3189789966MaRDI QIDQ2119933

İsa Çömez

Publication date: 31 March 2022

Published in: Meccanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s11012-021-01407-2

zbMATH Keywords

singular integral equationfunctionally graded piezoelectric materials (FGPMs)moving punchconducting punchmoving contact problem

Mathematics Subject Classification ID

Friction in solid mechanics (74M10) Electromagnetic effects in solid mechanics (74F15)

Related Items (1)

Frictional moving contact problem between a functionally graded monoclinic layer and a rigid punch of an arbitrary profile

Cites Work

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• The contact problem of a circular rigid punch on piezomagnetic materials
• On the use of the interpolation polynomial for solutions of singular integral equations
• The study of dynamic behavior of functionally graded piezoelectric materials and an application to a contact problem

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