Dynamic analysis for a vertical interface crack and the nearby circular cavity located at the piezoelectric bi-material half-space under SH-waves

DOI10.1007/s00707-020-02812-6zbMath1476.74083OpenAlexW3118669390MaRDI QIDQ2234160

Fuqing Chu, Hui Qi, Jing Guo, Ruochen Sun

Publication date: 18 October 2021

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-020-02812-6

zbMATH Keywords

dynamic stress intensity factorFredholm integral equationGreen function methodcomplex function mirror method

Mathematics Subject Classification ID

Singularities, blow-up, stress concentrations for dynamical problems in solid mechanics (74H35) Brittle fracture (74R10) Electromagnetic effects in solid mechanics (74F15) Wave scattering in solid mechanics (74J20) Complex-variable methods applied to problems in solid mechanics (74S70)

Related Items (1)

Dynamic analysis of the different types of elliptic cylindrical inclusions subjected to plane SH‐wave scattering

Cites Work

• Unnamed Item
• Dynamic analysis for circular inclusions of arbitrary positions near interfacial crack impacted by SH-wave in half-space
• Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials
• Scattering of anti-plane shear waves by a partially debonded piezoelectric circular cylindrical inclusion
• Interactions between \(N\) circular cylindrical inclusions in a piezoelectric matrix

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