On coupling contact analysis of thermoelectric materials
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Publication:2245837
DOI10.1016/J.APM.2020.08.024zbMath1481.74582OpenAlexW3062915615MaRDI QIDQ2245837
Publication date: 15 November 2021
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2020.08.024
Related Items (9)
Surface contact behavior of functionally graded thermoelectric materials indented by a conducting punch ⋮ Interfacial behavior of a thermoelectric film bonded to a graded substrate ⋮ Analysis of indentation of a 3m trigonal piezoelectric half-plane under a smooth insulating punch ⋮ Frictional continuous contact problem of thermoelectric materials loaded by a rigid indenter ⋮ Adhesive behavior between dissimilar materials subjected to thermo-elastic loadings with normal-tangential coupling effect ⋮ Thickness size effect on contact behavior of a thermoelectric strip ⋮ Continuous contact problem of thermoelectric layer pressed by rigid punch ⋮ The effectiveness of the bonding layer to attain reliable thermoelectric structures ⋮ The applicable range of the Goodman approximation in non-slipping contact of elastic materials with thermoelectric effects
Cites Work
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- Non-linear finite element formulation applied to thermoelectric materials under hyperbolic heat conduction model
- Finite element analysis of nonlinear fully coupled thermoelectric materials
- A continuum theory of thermoelectric bodies and effective properties of thermoelectric composites
- Transient thermo-electro-elastic contact analysis of a sliding punch acting on a functionally graded piezoelectric strip under non-Fourier heat conduction
- Exact, approximate and asymptotic solutions of the Klein-Gordon integral equation
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