A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface
From MaRDI portal
Publication:2306911
DOI10.1016/j.apm.2018.06.016zbMath1448.74041OpenAlexW2808854281WikidataQ129621988 ScholiaQ129621988MaRDI QIDQ2306911
Publication date: 27 March 2020
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2018.06.016
Related Items
Cites Work
- Two collinear unequal cracks in a poled piezoelectric plane: mode I case solved by a new approach of real fundamental solutions
- Limited permeable crack moving along the interface of a piezoelectric bi-material
- Moving anti-plane shear crack in a piezoelectric layer bonded to dissimilar elastic infinite spaces
- Propagation of a mode-III interfacial conductive crack along a conductive interface between two piezoelectric materials
- Thermal Green's functions in plane anisotropic multiferroic bimaterials with viscous interface
- Thermal Green's functions in plane anisotropic bimaterials with spring-type and Kapitza-type imperfect interface
- Electromechanical impact of an impermeable parallel crack in a functionally graded piezoelectric strip
- Dynamic crack propagation in piezoelectric materials. I: Electrode solution.
- An opening crack model for thermopiezoelectric solids
- Fracture analysis of cracked piezoelectric materials
- Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts
- A piezoelectric material strip with a crack perpendicular to its boundary surfaces.
- On modelling Bleustein-Gulyaev waves in non-homogeneous, transversely isotropic, piezoelectric media via stress equations of motion
- Electrostatic tractions at dielectric interfaces and their implication for crack boundary conditions
- Mode I fracture analysis of a piezoelectric strip based on real fundamental solutions
- The fracture behavior of functionally graded piezoelectric materials with dielectric cracks
- Theoretical model for roughness induced opening of cracks subjected to compression and shear loading
- On a moving interface crack with a contact zone in a piezoelectric bimaterial
- Interface crack-like shear that propagates in a brittle manner under compression -- a mesoscopic model
- Diffraction of antiplane shear waves by a finite crack in a piezoelectric material
- On a plane crack in piezoelectric solids
This page was built for publication: A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface
