Modeling of skin thermal pain: A preliminary study
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Publication:2378732
DOI10.1016/J.AMC.2008.05.045zbMath1152.92011OpenAlexW2128881200MaRDI QIDQ2378732
Ting Wen, K. A. Seffen, Tian Jian Lu, Feng Xu
Publication date: 14 January 2009
Published in: Applied Mathematics and Computation (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.amc.2008.05.045
Neural biology (92C20) Medical applications (general) (92C50) Biophysics (92C05) Thermodynamics and heat transfer (80A99)
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