Residual stresses in silicon-on-sapphire thin film systems

DOI10.1016/j.ijsolstr.2011.01.010zbMath1236.74190OpenAlexW2127459069MaRDI QIDQ2428387

Yanyan Li

Publication date: 24 April 2012

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2011.01.010

zbMATH Keywords

coolingthin filmresidual stressmultilayerbuffer layer

Mathematics Subject Classification ID

Thin films (74K35)

Uses Software

• ANSYS

Cites Work

• Multi-layer thin films/substrate system subjected to non-uniform misfit strains
• Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. I: Analysis for obtaining film stress from non-local curvature information
• Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. II: Experimental validation of the non-local stress/curvature relations
• Effects of thermoelasticity and a von Mises condition in rapid steady-state quasi-brittle fracture
• Thin Film Materials

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