Boundary element solution of thermal creep flow in microfluidic devices

DOI10.1016/j.enganabound.2012.01.001zbMath1351.78049OpenAlexW2002212174MaRDI QIDQ2520341

Henry Power, César Nieto, Mauricio Giraldo

Publication date: 13 December 2016

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.enganabound.2012.01.001

zbMATH Keywords

boundary element methodslip boundary conditionsthermal creepmicrofluidic devices

Mathematics Subject Classification ID

Stokes and related (Oseen, etc.) flows (76D07) Boundary element methods applied to problems in optics and electromagnetic theory (78M15)

Related Items (1)

A meshfree method based on radial basis functions for the eigenvalues of transient Stokes equations

Cites Work

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• Thermal analysis of micro‐channel heat exchangers with two‐phase flow using FEM

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