Transient analysis on surface heated piezoelectric semiconductor plate lying on rigid substrate

DOI10.1007/S10483-022-2927-6zbMath1506.82039OpenAlexW4310611868MaRDI QIDQ2690020

Luke Zhao, Feng Jin, Sen Gu, Y. Q. Song

Publication date: 14 March 2023

Published in: AMM. Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10483-022-2927-6

zbMATH Keywords

transient analysissurface heatingpiezoelectric semiconductor (PS)thermo-electro-elastic coupling

Mathematics Subject Classification ID

Statistical mechanics of semiconductors (82D37)

Cites Work

• A two-dimensional generalized thermal shock problem for a half-space in electromagneto-thermoelasticity
• Application of the homotopy analysis method to nonlinear characteristics of a piezoelectric semiconductor fiber
• A generalized linear thermoelasticity theory for piezoelectric media
• Thermoelasticity
• Thickness vibrations of a piezo-semiconducting plate layer
• Extension of a piezoelectric semiconductor fiber with consideration of electrical nonlinearity
• A generalized dynamical theory of thermoelasticity
• Numerical Inversion of Laplace Transforms: An Efficient Improvement to Dubner and Abate's Method

This page was built for publication: Transient analysis on surface heated piezoelectric semiconductor plate lying on rigid substrate