A finite difference scheme for solving a three-dimensional heat transport equation in a thin film with microscale thickness

DOI10.1002/nme.90zbMath0989.80026OpenAlexW2073212901MaRDI QIDQ2709679

Weizhong Dai, R. F. Nassar

Publication date: 2001

Published in: International Journal for Numerical Methods in Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1002/nme.90

zbMATH Keywords

stabilityfinite differencethin filmheat transport equationmicroscale

Mathematics Subject Classification ID

Finite difference methods applied to problems in thermodynamics and heat transfer (80M20)

Related Items (7)

Application of Convolution of Daubechies Wavelet in Solving 3D Microscale DPL Problem ⋮ A high order accurate numerical method for solving two‐dimensional dual‐phase‐lagging equation with temperature jump boundary condition in nanoheat conduction ⋮ Unified compact ADI methods for solving nonlinear viscous and nonviscous wave equations ⋮ An approximate analytic solution of the heat conduction equation at nanoscale ⋮ A mixed collocation-finite difference method for 3D microscopic heat transport problems ⋮ A compact difference scheme for numerical solutions of second order dual-phase-lagging models of microscale heat transfer ⋮ Solving macroscopic and microscopic pin-fin heat sink problems by adapted spectral method

Cites Work

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• Alternating direction and semi-explicit difference methods for parabolic partial differential equations
• A three‐dimensional numerical method for thermal analysis in X‐ray lithography
• A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography
• A domain decomposition method for solving thin film elliptic interface problems with variable coefficients
• Heat waves

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