The analysis of inter-laminar stress and electric potential for a laminated piezoelectric plate with interfacial damage

DOI10.1177/1081286510375346zbMath1269.74146OpenAlexW2312260497MaRDI QIDQ2842440

Fu Yiming, Li Sheng

Publication date: 14 August 2013

Published in: Mathematics and Mechanics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1177/1081286510375346

zbMATH Keywords

interfacial damagegeometric non-linearityfinite different methodlaminated piezoelectric platesinter-laminar stress and electric potential profile

Mathematics Subject Classification ID

Plates (74K20) Composite and mixture properties (74E30) Electromagnetic effects in solid mechanics (74F15) Brittle damage (74R05)

Cites Work

• A refined hybrid plate theory for composite laminates with piezoelectric laminae
• Modelling of cross-ply piezoelectric composite laminates in cylindrical bending with interfacial shear slip
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• A general theory for accurate stress analysis of homogeneous and laminated composite beams
• Cylindrical bending of angle-ply laminates subjected to different sets of edge boundary conditions
• A piezoelectric screw dislocation interacting with an imperfect piezoelectric bimaterial interface
• Crack Extension Force in a Piezoelectric Material
• Interlayer shear slip theory for cross-ply laminates with nonrigid interfaces
• Exact analysis of coupled electroelastic behaviour of a piezoelectric plate under cylindrical bending
• Fracture mechanics of piezoelectric materials
• Exact Solutions for Laminated Piezoelectric Plates in Cylindrical Bending
• Theory for Multilayered Anisotropic Plates With Weakened Interfaces
• Exact Solutions for Simply Supported Laminated Piezoelectric Plates
• On the effective conductivity of composites with ellipsoidal inhomogeneities and highly conducting interfaces
• An accurate de-lamination model for weakly bonded laminates subjected to different sets of edge boundary conditions.
• Thermal conduction of a circular inclusion with variable interface parameter.
• Effects of piezoelectric sensor/actuator debonding on vibration control of smart beams

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