Free convective overall heat transfer coefficient on inclined electronic assembly with active QFN16 package
From MaRDI portal
Publication:2967515
DOI10.1108/HFF-04-2015-0142zbMath1356.80041OpenAlexW2417376044MaRDI QIDQ2967515
Publication date: 28 February 2017
Published in: International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1108/hff-04-2015-0142
natural convectionenclosurepackagingconvective heat transfer coefficientelectronics thermal controlQFN16 package
Inverse problems in thermodynamics and heat transfer (80A23) Finite volume methods applied to problems in thermodynamics and heat transfer (80M12)
Related Items (1)
Uses Software
Cites Work
- Mixed convection in two-sided lid-driven differentially heated square cavity
- Hybrid lattice-Boltzmann finite difference simulation of convective flows.
- Effect of heating location and size on MHD mixed convection in a lid‐driven cavity
- Surface-radiation effect on natural convection flow in a fluid-saturated non-Darcy porous medium enclosed by non-isothermal walls
- Natural convection melting of NEPCM in a cavity with an obstacle using lattice Boltzmann method
- Free convective overall heat transfer coefficient on inclined electronic assembly with active QFN16 package
- Numerical simulation of two‐dimensional laminar mixed‐convection in a lid‐driven cavity using the mixed finite element consistent splitting scheme
- Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages
- Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme
This page was built for publication: Free convective overall heat transfer coefficient on inclined electronic assembly with active QFN16 package
