Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip

DOI10.1109/TC.2015.2493548zbMath1360.68292OpenAlexW2516697505MaRDI QIDQ2985288

Dong Xiang, Krishnendu Chakrabarty, Hideo Fujiwara

Publication date: 16 May 2017

Published in: IEEE Transactions on Computers (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1109/tc.2015.2493548

Mathematics Subject Classification ID

Performance evaluation, queueing, and scheduling in the context of computer systems (68M20)

Related Items (2)

Exact Wirelength of Embedding 3-Ary n-Cubes into Certain Cylinders and Trees ⋮ All-to-all broadcast in dragonfly networks

This page was built for publication: Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip